At Goermicro, we are dedicated to pioneering innovative processes technologies that power the next generation of semiconductproducts. By working hand-in-hwith our global R&D manufacturing teams, we ensure seamless transfer implementation of new technology nodes—strengthening our leadership in the industry.
We’re looking fpassionate talent to join our dynamic, forward-thinking team that is driving the future of technology.
Position: Advanced Packaging Engineer
As an Advanced Packaging Engineer, you will play a critical role in developing optimizing advanced packaging processes to enhance product quality, reliability, efficiency. Your work will directly impact yield improvement, cost reduction, productivity gains, risk management across our manufacturing lines.
Job Description:
1. Identify, diagnose, resolve die- wafer-level assembly process issues using methodologies such as failure analysis, FMEA, 8D, SPC/FDC.
2. Coordinate execute process, equipment, material evaluations/optimizations, implementing improvements at key process steps.
3. Lead participate in continuous yield improvement cost reduction initiatives.
4. Validate scale new process baselines, tools, materials fnew product introductions.
5. Support SPC/FDC/RMS/APC systems ensure site-to-site portability.
6. Manage audit material suppliers to achieve quality, cost, risk management objectives.
7. Support internal external audits.
Qualifications:
1. Master’s PhD in Materials Science, Chemistry, Physics, Mechanical Engineering.
2. Minimum 5 years of industry experience in Advanced Packaging.
3. Fluency in Chinese English is required.
Benefits:
1. Compensation & Benefits: 14-month salary package.
2. Five-day work week with weekends off, plus all national public holidays.
3. Social Security: Enrollment in social insurance housing fund upon onboarding.
4. Paid Leave: Entitlement to paid annual leave sick leave.
5. Visa Support: Company-sponsored Hong Kong Employment Visa (Hong Kong identity)
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